期刊论文

Sequential and Dendrite‐Free Li Plating on Cu Foil Enabled by an Ultrathin Yolk–Shell SiOx/C@C Layer

R He, Y Wang, C Zhang, Z Liu, P He, X Hong, R Yu, Y Zhao, J Wu, L Zhou, et al.

Advanced Energy Materials 13 (17), 2204075 · 2023